Front of Line Process Engineer

ENABLE your future through light. 

Excelitas is a global technology leader with more than 7,500 employees, focused on delivering market-driven solutions to fulfill the illumination, optical, detection and imaging needs of OEMs and end-users across the biomedical, semiconductor, industrial, consumer products, scientific, security, defense and aerospace sectors. 

ENGAGE with us today and make your contribution to the future! Join the team that leading technology companies turn to for cutting-edge photonic innovation. At Excelitas Technologies you are how we EXCEL. 

Our facility in Manila, Philippines has been operating since 1996 with key functions in Design and Development, Engineering, Manufacturing and other disciplines. This site specializes in product design, process development and mass production of Photodiodes, Photodiode Arrays and High-Performance Sensors. These product technologies are primarily for LiDAR applications such as autonomous vehicles and range finding, as well as safety and security applications including smoke detection and luggage scanning.

We are presently seeking for a Front of Line Process Engineer who shall be responsible for developing, sustaining, and improving assembly processes such as die attach, wire bonding, and die preparation, ensuring high yield, quality, and efficiency.

Main Responsibilities:

• Performs process engineering job on FOL processes specifically on wafer preparation (dicing, 2nd opt inspection), die attach, DA cure, wirebond, EJC coating, plasma cleaning and 3rd opt inspection or AOI.
• Process optimizations and process/material qualifications.
• Reviews and revises manufacturing documentations.
• Qualifies operators, new machines, new processes.
• Improves yield and COQ.
• Performs investigation on production line issues, drives resolution and corrective actions.
• Provides disposition on non-conforming products/materials.
• Provides in-depth analysis on process issues especially when it comes FOL processes and able to provide effective resolutions.

Requirements:

• Mechanical Engineering Graduate or other engineering field
• Preferably with at least 5 years of related work experience.

• Well versed in die attach and wirebond principles both in theoretical and actual applications. With experience in conducting DOE in FOL processes and on wirebond and DA machine qualifications. Capable of DA and wirebond material analysis.
• Must have good interpersonal skills. Good leadership skills and results oriented. Self-driven. Collaborative. Versatile and fast learner.

Other Requirements:

• With strong background in die attach, wirebond, AOI processes as well as in dicing/sawing process.
• Knowledgeable on SolidWorks or other simulation tools is a plus.
• Mechanical engineering graduate or other engineering field but with FOL experience.
• Capable of mechanical analysis and designing of jigs/toolings will be an advantage

Equal Opportunity/Affirmative Action Employer 
Minorities/Females/Disability/Gender Identity/Sexual Orientation 

Excelitas is seeking leaders and innovators to join our global team! Visit: https://jobs.excelitas.com/